Etimol SW 25 RAN
SMT-Stencil cleaning within automatic equipment
|Appearance/Consistancy:||Colorless to slightly yellow, clear|
|Density at 20 °C:||0,981 +/- 0,005 g/cm³|
|Boiling point/boiling range:||>100°C|
|Operations temperature:||Room temperature|
|Reliable cleaning results with:||Leaded, lead-free, no-clean solder pastes
|Shelf life:||36 month|
|Storage conditions:||Ideal in original packaging at 10°C-25°C|
SMT-Stencil cleaning within automatic cleaning equipment
The waterbased, pH-neutral cleaning media efficiantly removes leaded, leadfree, no-clean solder pastes and SMT-adhesives from SMT-stencils within automatic cleaing equipment. Etimol SW 25 RAN shows excellent dissolving properties that grant stable and high quality cleaning results and shows excellent rinsability with itself and DI-Water.
The cleaning media is used straight at room temperature and put within the cleaning tank of the automatic equipment.
Consider approvals of equipment manufacturer!
Consider compatibility of SMT-stencil adhesive!
Efficient removal of solder paste and SMT-adhesive from stencils grants repeatable and stable cleaning process which helps to achive high-quality printing results. The waterbased formulation combines high flashpoint and work safety level and helps to eliminate flammable solvents from within the production area.
Questions about our products?
We will advise you by phone 06123 / 7046-0.