No clean, alcohol-based flux, synthetic resin, di-carboxylic
acids, halogen-free (WEEE/RoHS conformant)
Type 18.104.22.168 // REL0 acc. ISO 9454 // DIN EN 61 190-1-1
Standard packaging units 20 L
|Appearance:||colorless to light yellow, clear|
|Solids content:||1.8 wt%|
|Density 20 °C:||0.793 (+/- 0.003) g/cm³|
|Acid number:||15 - 18 mg KOH/g|
|Activators/resin:||di-carboxylic acids, very low resin content|
|Flash point:||12 °C|
EO-B-004 involves a multiflux intended for wave (spray fluxes), selective, immersion, or manual soldering processes, which consists of alcohol-based solvents, synthetic resin and halogen-free activators. With a 1.8% solids content this variant was developed specially for full-tunnel nitrogen applications. It features a wide process window and great temperature stability to guarantee a better soldering result than that obtained with traditional adipic acid solutions under full nitrogen. Soldering results and cleanliness are quite good.
In practice it has been shown that with the correct application, the washing of printed circuit boards soldered with this flux can be largely dispensed with.
Multiflux: Wave soldering (spray fluxing), selective soldering, manual- and repair soldering, dip soldering
Customer added value:
- Wide range of applications (multiflux)
- Very good soldering properties (capillarity, wetting)
- Broad process window (very high thermal stability, good activity over a long interval)
- Recommended for N2-systems
- Very low solids content
- High surface resistance of flux residues (SIR) (even with selective special testing)
Questions about our products?
We will advise you by phone 06123 / 7046-0.